Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2006-05-09
2006-05-09
Smith, Zandra V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
C257S669000, C228S180500
Reexamination Certificate
active
07042087
ABSTRACT:
The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices30A,31A,32, 33A,34A and38. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire.These semiconductor devices have a plurality of circuit elements as one package, so that the mounting operation on the mounting board can be significantly reduced.
REFERENCES:
patent: 5428885 (1995-07-01), Takaya et al.
patent: 2781018 (1991-04-01), None
Kobayashi Yoshiyuki
Kusano Kazuhisa
Maehara Eiju
Sakai Noriyasu
Sakamoto Noriaki
Fish & Richardson P.C.
Rose Kiesha
Sanyo Electric Co,. Ltd.
Smith Zandra V.
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