Hybrid integrated circuit device

Electricity: electrical systems and devices – Miscellaneous

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156 89, 174 52FP, 174 52S, 264 61, 361402, 361414, H05K 109, H05K 114

Patent

active

045396221

ABSTRACT:
A hybrid integrated circuit device comprising in combination, a semiconductor integrated circuit element (1) and a film resistor pattern (7). The film resistor pattern is formed on the outer surface of a base (6) which is mounted on a multilayer ceramic package (2) which incorporates the element (1). In this assembled and operated hybrid device, function trimming of the film resistor pattern can be carried out by using a computer and testing is easier than is capable with prior art devices.

REFERENCES:
patent: 3243661 (1966-03-01), Ullery et al.
patent: 3588616 (1971-06-01), Palazzini
patent: 3665592 (1972-05-01), Apospors
patent: 3760090 (1973-09-01), Fowler
patent: 3882323 (1975-05-01), Smolker
patent: 4208698 (1980-06-01), Narasimhan
patent: 4225900 (1980-09-01), Ciccio et al.
patent: 4288841 (1981-09-01), Gogal
patent: 4296456 (1981-10-01), Reid
patent: 4320438 (1982-03-01), Ibrahim et al.
patent: 4342069 (1982-07-01), Link
patent: 4439754 (1984-03-01), Madden, Jr.
Patents Abstracts of Japan, vol. 6, No. 140, (E-121) (1018), Jul. 29th, 1982; & JP-A-57 64 953; Oki Denki Kogyo K.K., 4-20-1982; Semiconductor Device.
EPC Search Report, 82303178; 6/15/84, (3 pages).
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-2, No. 2, 6/79, pp. 208-217; "Hybrid IC Structures using Solder Reflow Technology".
Patents Abstracts of Japan, vol. 5, No. 70, (E-56) (742), 5/12/81; JP A-56-21349; Fujitsu K.K., 2-27-1981; "Package for Integrated Circuit".
Chemical Abstracts, vol. 85, No. 12, 1976, p. 552, No. 85961s, Columbus, Ohio, U.S.; Y. Taketa et al.: "Composition and Electrical Properties of Ruthenium (IV) Oxide Thick Film Resistors" & Nippon Daigaku Seisan Kogakubu Kogoku, 1975, 8(1), 17-24.
Schmeig, J. W., DIP Storage Module with Stacked Chips, IBM Tech. Disc. Bull., vol. 23, #6, Nov. 1980, p. 2337.

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