Hybrid integrated circuit device

Details Hybrid integrated circuit device Hybrid integrated circuit device

1982-08-31

1985-09-17

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

29843, 228175, 2281802, H05K 332

Patent

active

045424381

ABSTRACT:
Circuit elements and lead connecting metal pieces are set on a conductor circuit formed on a ceramic substrate and are bonded to the conductor circuit by reflow soldering. A head of a lead is set on each of the metal pieces and connected thereto by setting electrodes in contact with the lead head and supplying welding current from the electrodes through the lead head and metal piece.

REFERENCES:
patent: 2784297 (1957-03-01), Pityo
patent: 3233034 (1966-02-01), Grabbe
patent: 3238421 (1966-03-01), Patrick
patent: 3708878 (1973-01-01), Mann et al.
patent: 3740202 (1973-06-01), Swengel et al.
patent: 4242719 (1980-12-01), Conley
patent: 4296456 (1981-10-01), Reid
patent: 4349862 (1982-09-01), Bajorek et al.

Affiliated with

Also associated with

Rating

Hybrid integrated circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hybrid integrated circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hybrid integrated circuit device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-372845