Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-07-12
1995-01-17
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174256, 174257, 174258, 174261, 22818021, 22818022, 361750, 361751, 361760, 361765, 361766, 361767, 361768, 361777, 361779, 361808, 361811, 439 68, 439 83, 427 48, 427103, 427123, H05K 710
Patent
active
053830938
ABSTRACT:
A multilayer substrate is constituted by laminating a plurality of sheet substrates, the respective sheet substrates are constituted by forming conductive layers of a refractory metal such as tungsten (W) on ceramic green sheets composed mainly of an alumina ceramic, and the ceramic green sheets are laminated and sintered to constitute the multilayer substrate. Conductive material layers are formed on the surface of the multilayer substrate so as to be selectively connected to the conductive layers, and copper-plated layers are formed on the conductive material layers. Thick film conductor layers are formed on the copper-plated layers, to constitute terminal conductors, and, a thick film resistor layer for example is connected to the terminal conductors.
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Nippondenso Co. Ltd.
Picard Leo P.
Sparks D.
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