Hybrid integrated circuit and process for producing same

Details Hybrid integrated circuit and process for producing same Hybrid integrated circuit and process for producing same

1995-07-14

1996-07-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361761, 361776, 361807, 174 524, 257690, 257693, H05K 502

Patent

active

055329101

ABSTRACT:
A hybrid integrated circuit having a lead frame electrically connected to electronic components by means of a silver (Ag) paste, the hybrid integrated circuit comprising: an electroless-plated coating on the lead frame, the coating being free from an insulating surface oxide layer at least in a connection area in which the electrical connection is provided. A process of producing this hybrid integrated circuit comprises: a first step of electroless-plating a lead frame by using a phosphorus-containing reducing agent to form a coating on the lead frame; a second step of mounting electronic components on the lead frame and then electrically and mechanically connecting the former to the latter by means of an electroconductive paste; and a third step of maintaining the surface of the electroless-plated coating free from a phosphorus-containing oxide layer during the connecting operation.

REFERENCES:
patent: 4794048 (1988-12-01), Oboodi et al.
patent: 5057906 (1991-10-01), Ishigami

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