Hybrid integrated circuit and preparation thereof

Details Hybrid integrated circuit and preparation thereof Hybrid integrated circuit and preparation thereof

1983-06-22

1985-06-04

Lesmes, George F.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428699, 428607, 428652, 428674, 174 685, B32B 300, C23B 108, H01L 2710

Patent

active

045214760

ABSTRACT:
A hybrid integrated circuit is prepared by laminating an aluminum-copper clad foil on an insulating layer, etching the aluminum-copper clad foil with etching agents to form an aluminum circuit and a copper circuit and connecting a semiconductor element to the aluminum circuit through an aluminum wire or a gold wire while connecting a circuit element to the copper circuit by soldering.

REFERENCES:
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3801388 (1974-04-01), Akiyama et al.
patent: 3967371 (1976-07-01), Croset et al.
patent: 3983284 (1976-09-01), Croset
patent: 4190474 (1980-02-01), Berdan et al.
patent: 4404059 (1983-09-01), Livshits et al.

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