Hybrid integrated circuit and a method for producing the same

Details Hybrid integrated circuit and a method for producing the same Hybrid integrated circuit and a method for producing the same

1979-06-15

1981-10-27

Smith, Alfred E.

Amplifiers

With semiconductor amplifying device

Integrated circuits

361421, H03F 314, H05K 502

Patent

active

042976472

ABSTRACT:
A hybrid integrated circuit for high output power having a conductive pattern on a ceramic substrate, a lead frame connected to said pattern, and electronic components mounted on said pattern wired with one another, has been found. When said conductive pattern has an inductor in a spiral shape, the same spiral pattern is conformed on the lead frame, and those two spiral patterns are overlapped. Thus, the resistance of the inductor is reduced since the conductive pattern and the lead frame pattern are connected parallel to each other. Then, a large current can be loaded to said inductance with only a small loss. As the material of the lead frame is cheap, the resultant hybrid integrated circuit can be manufactured at a lower cost.

REFERENCES:
patent: 3958075 (1976-05-01), Kaufman
patent: 4037168 (1977-07-01), Kajiwara et al.
Filipkowski, A. et al., "Zastosowanie Technik Hybrydowych Do Realizacji Scalonych Wzmachiaczy Posrednie Czestotliwosci", Prace PIE, vol. 13, No. 1-2, 1972, pp. 67-74.

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