Hybrid integrated circuit

Details Hybrid integrated circuit Hybrid integrated circuit

1995-06-07

1996-08-20

Fields, Carolyn E.

Radiant energy

Infrared-to-visible imaging

Including detector array

2503383, G01J 534

Patent

active

055481183

ABSTRACT:
This is a new hybrid integrated circuit. The device may be an uncooled infrared detector, with the detector comprising: uncooled infrared elements on a first substrate; internal IC structures on a second substrate to be connected to the uncooled infrared elements: IC interlevel insulation on top of the internal IC structures: IC top level metal connections on top of the IC interlevel insulation: a protective overcoat over the IC top level metal and the IC interlevel insulation; a dry etch protective layer over the protective overcoat; thermal isolation mesas on the protective layer; and local interconnects over the thermal isolation mesas and the substrate, wherein the uncooled infrared detectors are connected to the internal IC structures through the local interconnects. In addition, the protective layer may include a photosensitive polyimide, a plasma deposited silicon dioxide (SiO.sub.2), a colloidal SiO.sub.2, a PMMA or a PIRL.

REFERENCES:
patent: 4608865 (1986-09-01), Muller et al.
patent: 5047644 (1991-09-01), Meissner et al.
patent: 5264326 (1993-11-01), Meissner et al.

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