Hybrid integrated circuit

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361748, 361801, 174 521, H05K 500

Patent

active

058479341

ABSTRACT:
A hybrid integrated circuit comprises a circuit substrate including an insulation substrate with various devices mounted thereon and with a patterned wiring having at least one selected electrode formed along one side of the insulation substrate and a metal conductor member including a plate portion with a pair of L-shaped clips, formed along one side thereof corresponding to the one side of the circuit substrate, for holding the circuit substrate inserted into the clips which are formed at places corresponding to the selected electrode of the circuit substrate so that the clips and the selected electrode make electrical contact when the circuit substrate is inserted into the clips.

REFERENCES:
patent: 5267125 (1993-11-01), Liu
patent: 5452184 (1995-09-01), Scholder et al.
patent: 5537294 (1996-07-01), Siwinski
patent: 5668701 (1997-09-01), Fukai
patent: 5691504 (1997-11-01), Sands et al.

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