Hybrid inorganic-organic composite for use as an interlayer diel

Details Hybrid inorganic-organic composite for use as an interlayer diel Hybrid inorganic-organic composite for use as an interlayer diel

1997-08-14

1999-10-12

Copenheaver, Blaine

Coating processes

Foraminous product produced

Microporous coating

438780, 438782, 521 55, 521 92, 521 93, 523202, 523203, 523216, C08J 936, C08K 1302

Patent

active

059652020

ABSTRACT:
Three-phase composite materials system having a low dielectric constant and physico-chemical properties suitable for IC fabrication conditions, and a method for making such materials, are disclosed. The three-phase composite material includes an organic phase, an inorganic phase and a void phase. The organic phase is in the form of an organic polymer matrix, the void phase is represented by microporosity present in the matrix, and the inorganic phase is implemented as inorganic particles that are coupled, via a coupling agent, to the organic matrix. The low dielectric constant of the composite is attributable to the microporous organic polymer matrix. The inorganic particles are responsible, at least in part, for providing thermal stability and other required physico-chemical properties to the composite.

REFERENCES:
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patent: 5514734 (1996-05-01), Maxfield et al.
patent: 5739180 (1998-04-01), Taylor-Smith
Miller et al, "Toughened Inorganic-Organic Hybrid Materials for Microelectronics Applications," no month noted. 1997 Proceedings for the 3rd International Dielectrics for ULSI Multilevel Interconnection Conference (DUMIC), Library of Congress No. 89-644090, pp. 295-302.
Hendricks, "Organic Polymers for IC Intermetal Dielectric Applications," v.38(6) Solid State Technology, p. 117ff., Jul. 1995.

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