Hybrid infrared detector array and CMOS readout integrated...

Communications: electrical – Systems – Signal box type

Reexamination Certificate

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C348S301000, C250S208100

Reexamination Certificate

active

07551059

ABSTRACT:
A hybrid image sensor includes an infrared detector array and a CMOS readout integrated circuit (ROIC). The CMOS ROIC is coupled to at least one detector of the IR detector array, e.g., via indium bump bonding. Each pixel of the CMOS ROIC includes a first, relatively lower gain, wide dynamic range amplifier circuit which is optimized for a linear response to high light level input signals from the IR detector. Each pixel also includes a second, relatively higher gain, lower dynamic range amplifier circuit which is optimized to provide a high signal to noise ratio for low light level input signals from the IR detector (or from a second IR detector). A first output select circuit is provided for directing the output of the first circuit to a first output multiplexer. A second output select circuit is provided for directing the output of the second circuit to a second output multiplexer. Thus, separate outputs of the first and second circuits are provided for each of the individual pixel sensors of the CMOS imaging array.

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Chih-Cheng Hsieh et al, “Focal Plan Arrays and CMOS Readout Techniques for Infrared Imaging Systems”, IEEE Transactions on Circuits and Systems for Video Technology, vol. 7, No. 4 (Aug. 1997).
O.Y. Pecht et al., “Wide Intrascene Dynamic Range CMOS APS Using Dual Sampling”, IEEE Transactions on Electron Devices, vol. 44, No. 10 (Oct. 1997).

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