Hybrid IC with heat sink

Details Hybrid IC with heat sink Hybrid IC with heat sink

1989-02-23

1990-08-14

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 801, 165185, 174 163, 357 81, 361388, 363144, H65K 720

Patent

active

049492209

ABSTRACT:
A hybrid IC with a heat sink includes a conductive substrate, a heat sink, an insulating sheet, a plurality of terminals, a power-consuming component, and a resin. The heat sink is separated from the conductive substrate. The insulating sheet is arranged on the conductive substrate. Electric components, wiring conductors, and connecting electrodes are arranged on a surface of the insulating sheet. The terminals are connected to the connecting electrodes on the insulating sheet. The power-consuming component is disposed on the heat sink to be connected to the wiring conductors on the insulating sheet through bonding wires. The resin seals the insulating sheet and a portion of the heat sink on which the power-consuming component is disposed.

REFERENCES:
patent: 4521828 (1985-06-01), Fanning
patent: 4639759 (1987-01-01), Neidig et al.

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