Hybrid IC device

Details Hybrid IC device Hybrid IC device

1987-03-17

1989-05-02

Kucia, R. R.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

174 522, 174 685, 361402, 427 97, H05K 0116

Patent

active

048273287

ABSTRACT:
A compact and dense hybrid integrated circuit device which can be encapsulated by transfer molding can be manufactured by forming through holes in a ceramic or glass substrate, which through holes have a diameter of less than 0.2 mm, preferably less than 0.1 mm, a thin film circuit element being formed on one surface of the substrate, and a thin or thick film circuit element being formed on the other surface of the substrate. A fine through hole as mentioned above can be formed by laser drilling, etc., and plating.

REFERENCES:
patent: 3745095 (1973-07-01), Chadwick et al.
patent: 4080513 (1978-03-01), Cuneo et al.
patent: 4437140 (1984-03-01), Ohyama et al.
patent: 4446477 (1984-05-01), Currie et al.
patent: 4628598 (1986-12-01), Taylor
patent: 4639290 (1987-01-01), Leyden et al.
patent: 4659587 (1987-04-01), Imura et al.
Norwood et al., Manufacturing Process for Hybrid Microcircuits Containing Vias, IEEE Transactions on Parts, Hybrids & V. PHP-1, #4, pp. 323-335, Dec. 1976.

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