Hybrid IC and electronic device using the same

Details Hybrid IC and electronic device using the same Hybrid IC and electronic device using the same

1998-10-13

1999-10-19

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361770, 361803, 361804, 439 74, 439 83, 257696, H05K 114

Patent

active

059699523

ABSTRACT:
In order to provide an improved hybrid IC having a high density, compact in size, capable of being manufactured with a reduced cost, a hybrid IC of the present invention, comprises: a circuit board 2 having formed on the surface thereof a plurality of electrode patterns, and mounting on the same surface a plurality of electronic elements 3; a plurality of connection terminals 4 each formed into a generally rectangular frame structure including mutually facing first and second lateral plates, and mutually facing first and second longitudinal plates. In particular, one of the first and second lateral plates of each connection terminal 4 is fixedly connected to a connection electrode 2a on the circuit board 2. With the use of such structure, it is allowed to dispense with a process of solely connecting the connection terminals, thereby reducing the time and hence the cost for manufacturing a hybrid IC. Further, it is allowed to connect only necessary connection terminals in optionally selected positions, thus avoiding additional cost which is unavoidable in a prior art. Moreover, it is possible to increase the freedom in the designing of a hybrid IC, rendering it possible to produce a hybrid IC which is compact in size, light in weight, and has a high density.

REFERENCES:
patent: 5422516 (1995-06-01), Hosokawa et al.
patent: 5588848 (1996-12-01), Law et al.

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