Hybrid IC

Details Hybrid IC Hybrid IC

1995-05-02

1998-05-12

Eisenzopf, Reinhard J.

Telecommunications

Receiver or analog modulated signal frequency converter

Frequency modifying or conversion

455127, 455128, 333247, H04B 128

Patent

active

057521824

ABSTRACT:
On a ceramic substrate, spiral-type inductors of a single layer wiring of a metal thin film are provided and respectively connected to a wiring pattern formed on another face of the substrate via through holes. A semiconductor chip is flip-chip mounted on the substrate in a face-down manner. On the face of the semiconductor chip, capacitors composed of a highly dielectric material, resistors formed by an ion implantation method or a thin-film forming method, and FETs are provided, respectively. Interconnection between the substrate and an external circuit board is achieved employing terminals formed at end faces of the substrate. The terminals have a concave shape with respect to the end face of the substrate. Thus, there is no need to use a package, and miniaturization and reduction in cost of a high-performance hybrid IC is achieved.

REFERENCES:
patent: 4522449 (1985-06-01), Hayward
patent: 5105171 (1992-04-01), Wen et al.
patent: 5105172 (1992-04-01), Khatibzadeh et al.
patent: 5448197 (1995-09-01), Sagawa et al.
patent: 5528203 (1996-06-01), Mohwinkel et al.

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