Hybrid heat sink with recirculating fluid and interleaving fins

Details Hybrid heat sink with recirculating fluid and interleaving fins Hybrid heat sink with recirculating fluid and interleaving fins

2005-12-07

2010-10-26

Walberg, Teresa J (Department: 3744)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S080400

Reexamination Certificate

active

07819175

ABSTRACT:
A method and incorporated hybrid air and liquid cooled heat sink that is provided for cooling electronic components. The heat sink comprises a finned structure having fins positioned for air to pass easily through them. The finned structure is flanked by a heat source plate on one side (closer to direction of heat flowing from electronic components) and a second plate on its opposing side such that both of the plates are in thermal communication with fin tips and fin base of the finned structure. The heat source plate itself is composed of two complementary halves with fins on each half. When brought together, the two halves form a unitary, fluid sealed plate while allowing passage of fluids through it by allowing the fins on each half to create and interleaving structure. A fluid re-circulator is also disposed at least partially in the plates for circulating fluids though the plates and the finned structure such that both fin tips and fin base are cooled.

REFERENCES:
patent: 6019165 (2000-02-01), Batchelder
patent: 6668911 (2003-12-01), Bingler
patent: 6863119 (2005-03-01), Sugito et al.
patent: 2004/0190250 (2004-09-01), Iijima et al.
patent: 2005/0103472 (2005-05-01), Lofland et al.
patent: 1588267 (2005-03-01), None

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