Hybrid heat sink performance enhancement using recirculating...

Details Hybrid heat sink performance enhancement using recirculating... Hybrid heat sink performance enhancement using recirculating...

2005-12-07

2008-03-18

Walberg, Teresa J. (Department: 3744)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S080300, C165S080400

Reexamination Certificate

active

07343963

ABSTRACT:
A method and incorporated heat sink that is cooled both thorough air flow and liquid circulation is provided. The heat sink is disposed close to electronic components and used for their cooling. It comprises a finned structure positioned such that air can easily pass though it; a heat source plate disposed thermally in direction of heat flow to one side of the finned structure such that the heat source plate is in thermal communication with the finned structure fin base and fin tips, and a second plate also disposed at an opposing end of the finned structure in thermal communication both with finned structure fin base and fin tips. The heat sink also includes fluid re-circulator disposed at least partially in the plates for circulating fluids though the plates and around said finned structure such that both fin tips and fin base is cooled.

REFERENCES:
patent: 3253646 (1966-05-01), Koltuniak et al.
patent: 4549603 (1985-10-01), Shirai et al.
patent: 6019165 (2000-02-01), Batchelder
patent: 6600649 (2003-07-01), Tsai et al.
patent: 6702002 (2004-03-01), Wang
patent: 6711016 (2004-03-01), Chung et al.
patent: 6729383 (2004-05-01), Cannell et al.
patent: 6798663 (2004-09-01), Rubenstein
patent: 6807056 (2004-10-01), Kondo et al.
patent: 7167364 (2007-01-01), Lopatinsky et al.
patent: 2002/0029873 (2002-03-01), Sugito et al.
patent: 2001/0101718 (2002-08-01), Negishi et al.
patent: 2004/0066625 (2004-04-01), Meyer et al.

Affiliated with

Also associated with

Rating

Hybrid heat sink performance enhancement using recirculating... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hybrid heat sink performance enhancement using recirculating..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hybrid heat sink performance enhancement using recirculating... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3976840