Hybrid frame with lead-lock tape

Details Hybrid frame with lead-lock tape Hybrid frame with lead-lock tape

1996-07-29

1998-02-10

Meier, Stephen

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257691, H01L 23495, H01L 2352

Patent

active

057172463

ABSTRACT:
A hybrid lead frame having leads for conventional lead-to-I/O wire bonding, and leads for power and ground bussing that extends over a surface of the semiconductor die are provided where the leads for bussing are held in place by lead-lock tape to prevent bending and/or other movement of the bussing leads during manufacturing. More specifically, the lead-lock tape is transversely attached across a plurality of bussing leads proximate to and outside of the position where the die is to be attached.

REFERENCES:
patent: 4033844 (1977-07-01), Pantiga et al.
patent: 4089733 (1978-05-01), Zimmerman
patent: 4279682 (1981-07-01), Hamagami et al.
patent: 4801999 (1989-01-01), Hayward et al.
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4891687 (1990-01-01), Mallik et al.
patent: 4894752 (1990-01-01), Murata et al.
patent: 4984059 (1991-01-01), Kubota et al.
patent: 4989068 (1991-01-01), Yasuhara et al.
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5142450 (1992-08-01), Olson et al.
patent: 5184208 (1993-02-01), Sakuta et al.
patent: 5218229 (1993-06-01), Farnworth
patent: 5227661 (1993-07-01), Heinen
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5231755 (1993-08-01), Emanuel
patent: 5233220 (1993-08-01), Lamson et al.
patent: 5252853 (1993-10-01), Michii
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5331200 (1994-07-01), Teo et al.
patent: 5331201 (1994-07-01), Nishino
patent: 5352633 (1994-10-01), Abbott
patent: 5418189 (1995-05-01), Heinen
patent: 5461255 (1995-10-01), Chan et al.
patent: 5466888 (1995-11-01), Beng et al.
patent: 5471369 (1995-11-01), Honda et al.
patent: 5475918 (1995-12-01), Kubota et al.
Caroline A. Kovac et al.; "Plastic Package Fabrication"; pp. 470-482, no date.
Louis T. Manzione; "Plastic Packaging of Microelectronic Devices"; 1990; pp. 156-161, 168-173, 186-189, 194-199, 212-215, 224-229, 302-303 and 346-347, no month.

Affiliated with

Also associated with

Rating

Hybrid frame with lead-lock tape does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hybrid frame with lead-lock tape, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hybrid frame with lead-lock tape will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2079350