Hybrid ferromagnetic integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Magnetic field

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Details

257422, 257427, 257778, 257425, H01L 2722

Patent

active

053249771

ABSTRACT:
A hybrid integrated circuit device has a magnetic sensor formed directly on a substrate by photolithography. Alternatively, a flip chip type magnetic sensor is mounted on a substrate by fusion. The magnetic sensor can be mounted on the substrate with high positional precision.

REFERENCES:
patent: 4398342 (1983-08-01), Pitt et al.
patent: 4823177 (1989-04-01), Prinz et al.
patent: 4945397 (1990-07-01), Schuetz
patent: 5005064 (1991-04-01), Yoshino et al.
patent: 5196821 (1993-03-01), Partin et al.

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