Hybrid electrical circuit method with mated substrate...

Details Hybrid electrical circuit method with mated substrate... Hybrid electrical circuit method with mated substrate...

2005-12-06

2005-12-06

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S847000, C029S852000, C029S833000, C029S834000, C029S740000, C257S315000, C257S316000, C438S201000

Reexamination Certificate

active

06971160

ABSTRACT:
A hybrid integrated circuit fabrication method in which an insulating substrate member and its metallic substrate carrier are made to be mating with precision through use of computer controlled machining performed on each member. A combination of disclosed specifically tailored software and commercially available software are used in the method to generate code for controlling a precision milling machine during the fabrication of substrate and substrate carrier members. The method for precision mating of substrate and substrate carrier enable disposition of a precision recess in the substrate carrier and the location of recess pillars and pedestals (the latter being for integrated circuit die mounting use) at any carrier recess location desirable for electrical, thermal or physical strength reasons. Enhanced electrical thermal and physical properties are achieved in hybrid devices fabricated according to the method especially when compared with devices and methods having the limited availability of comparable elements afforded by previous hybrid fabrication arrangements.

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