Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-07-15
2008-07-15
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080400, C165S185000, C174S015100, C062S259200, C361S699000, C361S694000, C361S695000
Reexamination Certificate
active
07400505
ABSTRACT:
A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.
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Campbell Levi A.
Chu Richard C.
Ellsworth, Jr. Michael J.
Iyengar Madhusudan K.
Schmidt Roger R.
Esq. Lily Neff
Heslin Rothenberg Farley & & Mesiti P.C.
International Business Machines - Corporation
Radigan, Esq. Kevin P.
Thompson Gregory D
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