Hybrid compression socket connector for integrated circuits

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C257S779000, C439S066000, C324S755090

Reexamination Certificate

active

10955676

ABSTRACT:
The apparatus and method described herein are for coupling an integrated circuit to a circuit board, while eliminating the need for a backing plate, when a compression socket is utilized. A plurality of tension pins are coupled to an integrated circuit for engaging a plurality of corresponding barrels in a circuit board to compress a compression socket to make an electrical connection between the integrated circuit and the circuit board.

REFERENCES:
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patent: 4917613 (1990-04-01), Kabadi
patent: 5057023 (1991-10-01), Kabadi et al.
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patent: 5625166 (1997-04-01), Natarajan
patent: 5955888 (1999-09-01), Frederickson et al.
patent: 6476476 (2002-11-01), Glenn
patent: 6490676 (2002-12-01), Cota-Robles
patent: 6585527 (2003-07-01), Koopman et al.
patent: 6614659 (2003-09-01), Feigenbaum et al.
patent: 2003/0168738 (2003-09-01), Kabadi
U.S. Appl. No. 10/982,103, filed Nov. 4, 2004, entitled “Low Profile and Tight Pad-Pitch Land-Grid-Array (LGA) Socket”.

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