Hybrid circuit formed of two circuits whose tracks are connected

Details Hybrid circuit formed of two circuits whose tracks are connected Hybrid circuit formed of two circuits whose tracks are connected

1991-10-25

1993-07-06

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

174 84R, 174250, 174260, 174261, H01R 402

Patent

active

052256340

ABSTRACT:
Hybrid circuit formed of two circuits (1, 2) combined by spherical balls (10) with electric connection.
The conductive tracks (6) the balls (10) connect do not adhere to the circuits (1, 2) at portions (11) situated around the balls (10). As a result, these portions (11) may be safely removed and the balls (10) are able to roll onto the circuits (1, 2) if the latter are subjected to a relative movement due, for example, to differential thermic cubical expansions. Thus, the balls (10) are not stressed.

REFERENCES:
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 4783722 (1988-11-01), Osaki et al.
patent: 5011066 (1991-04-01), Thompson
patent: 5121299 (1992-06-01), Frankeny et al.
"VLSI Chip Interconnection Technology Using Stacked Solder Bumps" Proceedings of the 37th Electronic Components Conference May 11-13 1987, pp. 573-578 IEEE, New York, U.S.; N. Matsui et al.

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