Hybrid circuit device

Wave transmission lines and networks – Coupling networks – Delay lines including a lumped parameter

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Details

174 52PE, 174 52FP, 333140, 339 17CF, 357 72, 357 74, 357 80, 361380, 361395, 361404, H03H 732, H05K 116

Patent

active

045062382

ABSTRACT:
A hybrid circuit device comprising a flat package incorporating an integrated circuit therein, and a delay line constituted by a plurality of coils and capacitors. The base plate having the delay line mounted on one main surface thereof is placed, at the other main surface thereof, on the flat package. Upwardly bent terminals and non-bent terminals are led out of the flat package. The upwardly bent terminals connect the integrated circuit and delay line to each other at side portions of the base plate. Furthermore, separate terminals are provided in two rows holding the flat package therebetween and connected to the non-bent terminals of the flat package. The device is encapsulated, with the free end portion of each of the separate terminals being exposed.

REFERENCES:
patent: 2926340 (1960-02-01), Blain et al.
patent: 3602846 (1971-08-01), Hauser
patent: 4012765 (1977-03-01), Lehner et al.

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