Hybrid chip fuse assembly having wire leads and fabrication...

Details Hybrid chip fuse assembly having wire leads and fabrication... Hybrid chip fuse assembly having wire leads and fabrication...

2005-03-28

2009-08-04

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S665000

Reexamination Certificate

active

07569907

ABSTRACT:
A chip fuse includes a substrate, a fuse element extending on the substrate, and first and second wire leads coupled to the fuse element. Contact pads may extend over portions of the fuse element and establish electrical connection to the first and second leads. A conductive medium such as solder encircles the substrate to securely form a mechanical and electrical connection to the leads.

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International Search Report for International Application No. PCT/US2006/011527; Nov. 28, 2006; 6 pages.

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