Hybrid chip card capable of both contact and contact-free operat

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Patent

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Details

257728, 235492, 343866, 343873, H01L 2302, H01Q 138, H01Q 140, G06K 1906

Patent

active

055980325

ABSTRACT:
A contact-free card and a method for the manufacture of such a card. The card comprises a card body, an electronic module having an integrated chip card and two contact zones, and an antenna connected to the contact zones of said module by two contact terminals, wherein said module furthermore has contact pads connected to said chip for a contact-using operation of said card. Said method has a step according to which a layer of the card body is negative-molded on the antenna and a cavity is made in the card body, revealing said contact terminals of the antenna, followed by a step according to which the electronic module is mounted in the cavity of the card body. The invention can be applied to the manufacture of contact-free cards, which may or may not be combined and designed, for example, for remote cash type of operations.

REFERENCES:
patent: 5067008 (1991-11-01), Yanaka et al.
patent: 5206495 (1993-04-01), Kreft
patent: 5208450 (1993-05-01), Uenishi et al.

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