Hybrid CCD imaging

Details Hybrid CCD imaging Hybrid CCD imaging

1996-03-12

1997-07-29

Picardat, Kevin

Fishing, trapping, and vermin destroying

437 3, 437 5, 437206, 437245, H01L 3118

Patent

active

056521502

ABSTRACT:
A preferred embodiment of this invention is a hybrid semiconductor imaging structure comprising a high speed signal conditioning substrate (e.g. Si 12) and an imaging substrate (e.g. HgCdTe 10) mounted on the conditioning substrate using an adhesive layer (e.g. epoxy 31). Infrared-sensitive time delay and integration CCD columns (14) charge coupled to sense nodes (e.g. diodes 16) are disposed in the imaging substrate. High speed signal processing channels (e.g. capacitive transimpedance amplifier 18, correlated double sampling circuit 20 and multiplexing shift register 22) are disposed in the conditioning substrate. The sense nodes are connected to the signal processing channels with low capacitance hybrid leads (e.g. Al 17).

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