Hybrid and multi-layer circuitry

Details Hybrid and multi-layer circuitry Hybrid and multi-layer circuitry

1985-12-20

1987-09-29

Kittle, John E.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428212, 428901, 427 97, B05D 512, B32B 300, B32B 702

Patent

active

046968512

ABSTRACT:
The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a layer of foil bonded thereto by a high temperature organic adhesive. The foil may be etched and have a resistive metal alloy tape can be bonded so as to provide a path of precise resistance. Also, layers of foil may be bonded to a substrate and stacked to form multi-layer circuit assemblies.

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"Tab Technology Tackles High Density Interconnections", by Dickson, pp. 34-39, Dec. 1984, Electronic Packaging and Production.

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