Hybrid and multi-layer circuitry

Details Hybrid and multi-layer circuitry Hybrid and multi-layer circuitry

1985-12-20

1987-12-08

Grimley, Arthur T.

Electricity: electrical systems and devices

Miscellaneous

29846, 174 685, 361397, 361414, 428209, H05K 706

Patent

active

047121610

ABSTRACT:
The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a deoxidized or oxygen free copper alloy foil bonded thereto by a bonding glass. The copper alloy foil may be a circuit to which a resistive metal alloy tape can be bonded so as to provide a path of precise resistance. Also, layers of foil may be glass bonded to a substrate and stacked to form multi-layer circuits.

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