Hybird packaging of integrated I/O interface device and connecto

Details Hybird packaging of integrated I/O interface device and connecto Hybird packaging of integrated I/O interface device and connecto

1993-12-06

1995-05-16

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Flexible panel

439516, 439925, H01R 907

Patent

active

054155568

ABSTRACT:
A connector module for connecting at least one of an input device and an output device to a multi-wire bus including a first stage supporting the multi-wire bus, a second stage having an IC chip mounted on a lead frame, the lead frame including first electrical connections for connecting the input and output devices to the IC chip and second electrical connections including a plurality of stamped metal contacts that are bent with one end formed for an insulation displacement contact with multi-signals between the multi-wire bus and the input and output devices, and a stage fastener for interlocking the first stage to the second stage. Also disclosed are a first plurality of conductive patterns for connecting the input and output devices to the IC chip, and a second plurality of conductive patterns for connecting the multi-wire bus to the IC chip the second plurality of conductive patterns including button contacts for conveying signals between the multi-wire bus and the input and output devices.

REFERENCES:
patent: 4932873 (1990-06-01), La Shier
patent: 5037308 (1991-08-01), Bryce et al.
patent: 5044964 (1991-09-01), Minerd et al.
patent: 5125846 (1992-06-01), Sampson et al.

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