Organic compounds -- part of the class 532-570 series – Organic compounds – Carbohydrates or derivatives
Reexamination Certificate
2003-04-18
2008-11-25
Jiang, Shaojia Anna (Department: 1623)
Organic compounds -- part of the class 532-570 series
Organic compounds
Carbohydrates or derivatives
C514S054000
Reexamination Certificate
active
07456275
ABSTRACT:
The present invention provides a safe hyaluronic acid base material that is suitable for use in practical hyaluronic acid pharmaceutical preparations capable of distribution at room temperature and having such a low viscosity that injection is easy. The hyaluronic acid pharmaceutical preparations can reside in a joint cavity for a prolonged period of time while exhibiting analgesic effects. More specfically, there is provide a hyaluronic acid modification product in which hyaluronic acid and/or a pharmaceutically acceptable salt thereof is bounded to a block polymer selected from PEO-PPO-PEO, PPO-PEO-PPO, PEO-PLGA-PEO, PLGA-PEO-PLGA, PEO-PLA-PEO and PLA-PEO-PLA. The hyaluronic acid modification product, despite capability of distribution at room temperature and ease in handling because of the low viscosity, can have its viscoelasticity rapidly increased after injection into a living body, so that it is highly useful in treatment of joint diseases, aid in surgical operation, repair of tissue, etc. as a main ingredient of novel and practical hyaluronic acid pharmaceutical preparations.
REFERENCES:
patent: 5470911 (1995-11-01), Rhee et al.
patent: 5490978 (1996-02-01), Spaltro et al.
patent: 2007/0031503 (2007-02-01), Hirakura et al.
patent: 04-261664 (1992-09-01), None
patent: 05-262882 (1993-10-01), None
patent: 09-227329 (1997-09-01), None
patent: 11-169703 (1999-06-01), None
patent: 2002-256075 (2002-09-01), None
patent: WO-95/15152 (1995-06-01), None
patent: WO-97/24430 (1997-07-01), None
patent: WO-99/18142 (1999-04-01), None
patent: WO-00/27405 (2000-05-01), None
“Soshiki Kogaku ni Okeru Jinko Saibo-gai Matrix Sekkai: Kan'on-sei Hyaluronic Acid no Gosei to Kozoka' (Artificial Extracellular Matrix Design in Tissue Engineering: Synthesis of Thermoresponsive Hyaluronic Acid and Its Supramolecular Organization)” by Oya et al., The Japanese Journal of Artificial Organs (2000), 29(2), pp. 446-451.
Patent Abstracts of Japan for JP2002-256075 published on Sep. 11, 2002.
Patent Abstracts of Japan for JP04-261664 published on Sep. 17, 1992.
“Injectable Hyaluronic Acid Gel for Soft Tissue Augmentation—A Clinical and Histological Study” by Duranti et al., American Society for Dermatologic Surgery, Inc., 1998, pp. 1317-1325.
Patent Abstracts of Japan for JP05-262882 published on Oct. 12, 1993.
Patent Abstract of Japan for JP09-227329 published on Sep. 2, 1997.
Patent Abstracts of Japan for JP11-169703 published on Jun. 29, 1999.
“Temperature-responsive gels and thermogelling polymer matrices for protein and peptide delivery” by Bromberg et al., Advanced Drug Delivery Reviews 31, 1998, pp. 197-221.
“A Retention Test after Single Intra-articular Administration of High Molecular Weight Sodium Hyaluronate (NRD101) into the Rabbit Knee” by Umeda et al., Japan Pharmacology Therapeutics, vol. 22, Supplement, Mar. 1994, pp. 387(S-779)-393(S-785).
“Thermoresponsive Artificial Extracellular Matrix for Tissue Engineering: Hyaluronic Acid Bioconjugated with Poly(N-isopropylacrylamide) Grafts” by Ohya et al., Biomacromolecules 2001, 2, pp. 856-863.
“Temperature-responsive and degradable hyaluronic acid/Pluronic composite hydrogels for controlled release of human growth hormone” by Kim et al., Journal of Controlled Release 80 (2002) pp. 69-77.
Chugai Seiyaku Kabushiki Kaisya
Darby & Darby P.C.
Jiang Shaojia Anna
Olson Eric S
LandOfFree
Hyaluronic acid modification product does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hyaluronic acid modification product, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hyaluronic acid modification product will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4029716