Housing of network device

Details Housing of network device Housing of network device

2002-10-10

2004-07-06

Reichard, Dean A. (Department: 2831)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S735000, C312S223200

Reexamination Certificate

active

06760218

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to network devices and more particularly to a housing structure of such network device with improved characteristics.
BACKGROUND OF THE INVENTION
Typically, each of the various commercially available network devices such as hubs, switches, modems, printer servers, gateways, and ISDNs (Integrated Services Digital Networks) has a housing. In one configuration a plurality of such network devices are coupled to a computer. Hence, a user can operate the computer to access the Internet by means of the coupled network devices. However, it is obvious that such plurality of network devices can occupy a considerable portion of limited space on or around the user's desk. Further, one network device may have a different size and/or shape from the other. Hence, the network devices cannot be orderly stacked. In fact, they are messy. This can cause difficulty in detecting, maintaining, and managing the network devices.
A commercially available network product having a stackable structure is shown in
FIGS. 1 and 2
. the network product comprises a parallelepiped housing
1
having an arcuate projection
10
on a top side, the projection
10
having a straight side recessed from the corresponding side and perpendicular to other two sides of the housing
1
, a tab
12
on either side of the projection
10
, a plurality of slits
14
on the projection
10
at one of two other sides, two parallel bottom seats
11
, two opposite slits
13
each at the seat
11
, and a rib
15
between the seats
11
being disposed corresponding to one of the slits
14
. Thus, one housing
1
can be stacked on the other one having the same structure by matingly coupling.
Another commercially available network product having a stackable structure is shown in
FIGS. 3 and 4
. the network product comprises a parallelepiped housing
2
having an arcuate projection
20
on a top side adjacent one edge, the projection
20
having a first finger-shaped dent
22
, a recess
21
on the top side adjacent the other opposite edge, the recess
21
having an indent
23
, a lengthwise wave-shaped section
24
about at a center on the top side, and a plurality of recessed portions
26
at valleys of the wave-shaped section
24
. the housing
2
further comprises, at the other side opposite to the projection
20
, a first finger-shaped protrusion
25
, a second finger-shaped protrusion
27
disposed corresponding to the recess
21
, and two protuberances
29
disposed corresponding to the recessed portions
26
. Thus, one housing
2
can be stacked on the other one having the same structure by matingly coupling.
However, the network product is disadvantageous for being complicated in design, having a plurality of components of different shapes, being difficult to manufacture, consuming more material, and being expensive in manufacturing. All of these contradict the trend of cost effective and high efficiency of the hi-tech oriented society. Thus improvement exists.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a network device having a parallelepiped housing comprising a plurality of slots on two opposite sides and two opposite edges at each of an underside and a top and a plurality of pads each fastened the slots. This forms a short distance between a supporting surface and the underside of the housing by the projected pad. Also, housings of the same type of network devices can be stacked or horizontally coupled together by fastening the pads in the slots to form a gap between two stacked housings by the coupled pads for dissipating heat of the housings therefrom. By utilizing this, it is not only possible of stacking or horizontally coupling together the housings but also effect a good heat dissipation.


REFERENCES:
patent: 5864467 (1999-01-01), Recchia et al.
patent: 6085925 (2000-07-01), Chung
patent: 6328612 (2001-12-01), Chung
patent: 6567275 (2003-05-01), Hou et al.
patent: 6597567 (2003-07-01), Stone et al.

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