Housing of electronic devices and method

Details Housing of electronic devices and method Housing of electronic devices and method

2008-10-20

2010-12-07

Gandhi, Jayprakash N (Department: 2835)

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Flash or sprue removal type

C264S163000, C264S255000, C264S279000, C264S328800, C361S679010, C361S679550

Reexamination Certificate

active

07846362

ABSTRACT:
A method for making a housing, comprising steps of: providing an mold, the mold including a first female mold and a second female mold setting beside the first female mold, a male mold matingly engageable with the first female mold and the second female mold; the first female mold mating the male mold to form a first mold chamber; injecting molten material into the first mold chamber to form a main body on the male mold; setting a decorative film in the second female mold; rotating the male mold into contact with the second female mold to form a second mold chamber; injecting some transparent resin material into the second mold chamber to form a transparent plate.

REFERENCES:
patent: 2001/0038493 (2001-11-01), Watanabe et al.
patent: 2003/0203219 (2003-10-01), Lin et al.
patent: 2009/0092838 (2009-04-01), Wu
patent: 57112965 (1992-07-01), None

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