Housing forming method and housing structure

Details Housing forming method and housing structure Housing forming method and housing structure

2006-05-23

2006-05-23

Alavi, Ali (Department: 2875)

Illumination

Light source and modifier

Including translucent or transparent modifier

C362S546000, C362S507000

Reexamination Certificate

active

07048415

ABSTRACT:
An object of the invention is to provide a method for easily molding projections on an end edge along an opening in a housing which project towards an opposite side of the end edge to the opening, and to provide a housing structure related to the method.The invention relates to a method for molding a housing, including molding an end edge (6) which extends outwardly of an opening (4) in a housing (1) such that a closing member (5) for closing the opening (4) is locked thereto by using a first mold (30) having a grating-like portion and a second mold (40) adapted to alternately mesh with the grating-like portion of the first mold (30), and forming an projection (28) which projects towards an opposite side to the opening (4) on an outer side of the end edge (6) by drawing out the grating-like portion of the first mold (30) which penetrates the end edge (6) towards the opening (4) side which is opposite to an end portion of the grating-like portion and drawing out the second mold (40) from the end edge (6) position outwardly of the housing (1).

REFERENCES:
patent: 6270242 (2001-08-01), Suzuki et al.
patent: 6523983 (2003-02-01), Young, Jr.
patent: 6619830 (2003-09-01), Nagakura et al.
patent: 6811285 (2004-11-01), Ferguson et al.

Affiliated with

Also associated with

Rating

Housing forming method and housing structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Housing forming method and housing structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Housing forming method and housing structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3557665