Housing for semiconductor devices, semiconductor device pin,...

Details Housing for semiconductor devices, semiconductor device pin,... Housing for semiconductor devices, semiconductor device pin,...

2006-06-13

2006-06-13

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S123000, C438S106000

Reexamination Certificate

active

07060534

ABSTRACT:
A housing, in particular for semiconductor devices, a semiconductor device pin, and a method for the manufacturing of pins wherein at least one pin is punched out from a basic body, in particular a lead framed, by means of one or a plurality of punching process steps, wherein the pin is coated with a separate metal layer after the final punching out of said pin.

REFERENCES:
patent: 5736428 (1998-04-01), Kasai et al.
patent: 5877548 (1999-03-01), Washida et al.
patent: 5940279 (1999-08-01), Gademann et al.
patent: 63-272061 (1988-11-01), None
patent: 2-28356 (1990-01-01), None
patent: 02158162 (1990-06-01), None
patent: 8-46112 (1996-02-01), None
patent: 2000150771 (2000-05-01), None

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