Housing for power semiconductor modules

Details Housing for power semiconductor modules Housing for power semiconductor modules

2007-07-10

2007-07-10

Datskovsky, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S678000, C257S693000, C439S076100, C361S728000, C361S752000

Reexamination Certificate

active

10736378

ABSTRACT:
A housing for power semiconductor modules with a base plate or for direct mounting on a heat sink. The housing (10) surrounds an electrically insulating substrate (40) with metal connection tracks (41) disposed thereon. The metal connection tracks are insulated from one another and have power semiconductor components (50) disposed on them. The housing has a cap (14) and at least one framelike housing part (12) forming the side walls thereof. This housing part (12) includes a main frame (120) and at least one locking frame (130). The main frame (120) has guides (122, 128) for receiving connection elements (30, 32). The locking frame (130) is disposed relative to the main frame (120) such that it rests at least in part on the connection tabs (310, 320) of the connection elements (30, 32), in order to prevent movemnt of the connection elements toward the substrate (40).

REFERENCES:
patent: 4218724 (1980-08-01), Kaufman
patent: 4449165 (1984-05-01), Kaufman
patent: 4630174 (1986-12-01), Kaufman
patent: 5625536 (1997-04-01), Soyano et al.
patent: 5761040 (1998-06-01), Iwasa et al.
patent: 6828600 (2004-12-01), Lenniger et al.
patent: 6995461 (2006-02-01), Soyano et al.
patent: 43 25 942 (1995-02-01), None
patent: 0 513 410 (1991-05-01), None
patent: 0 513 410 (1992-11-01), None
patent: 0 750 345 (1996-12-01), None
patent: 07-153906 (1995-06-01), None
German Office Action dated Oct. 7, 2003 issued in corresponding application No. 102 58 570.9.
Translation of German Office Action dated Oct. 7, 2003 issued in corresponding application No. 102 58 570.9.

Affiliated with

Also associated with

Rating

Housing for power semiconductor modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Housing for power semiconductor modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Housing for power semiconductor modules will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3742987