Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-10-28
1994-05-10
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 522, 257713, 361707, H05K 720
Patent
active
053113985
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The invention relates to a housing for installation in motor vehicles in order to accommodate electronic components.
Electronic control and regulating systems are increasingly employed in motor vehicles. Their components are accommodated in housings which sufficiently protect them against the stresses and interferences occurring during operation. Such housings are partially or completely constructed as metal housings so as to suppress electromagnetic interferences (EMC* interferences). At the same time, such a metal housing serves to dissipate the heat generated by the electrical power so that the electronic components can function properly at an ambient temperature of -40.degree. C. to 120.degree. C., for example, by the additional use of cooling fins.
This requirement for temperature resistance together with the requirement that the housing be tight makes the overall housing suitable for the engine area. In order to meet all of these requirements, complicated structures are often provided for such housings which also results in high manufacturing costs.
SUMMARY OF THE INVENTION
It is therefore the object of the invention to provide a housing of the above-mentioned type which has a simple structure and thus can be manufactured economically.
A first embodiment of the invention comprises a multi-layer circuit board or a multi-layer film which, on one side, is equipped with SMD components and a metal plate as the carrier for the multi-layer circuit board or film, with the planar expanse of the metal plate being greater than the planar expanse of the multi-layer circuit board or film, wherein the multi-layer circuit board or film is disposed on, attached to and insulated from the metal plate. The invention further comprises power components disposed on the surface of the metal plate in a region not covered by the multi-layer circuit board or film with the metal plate serving as a heat sink for the power components; a connector mounted on the metal plate in a region covered by the multi-layer circuit board or film such that the connection pins of the connector are brought into the multi-layer circuit board or film and the coupling side of the connector lies on the planar side of the metal plate which is opposite the side carrying the multi-layer circuit board or film; and mechanical cover means which are attached to the metal plate to form a flat housing, in which the mechanical cover means cover the side of the metal plate carrying the multi-layer circuit board or film.
A second embodiment of the invention comprises a multi-layer film which, on one side, is equipped with SMD components and a metal plate as the carrier for the multi-layer film, with the planar expanse of the metal plate having a similar shape and size to the planar expanse of the multi-layer film, wherein the multi-layer circuit board or film is disposed on, attached to and insulated from the metal plate. The invention further comprises a connector mounted to the metal plate such that the connection pins of the connector are brought through a passage in the metal plate and into the multi-layer film, and a region of the multi-layer film carrying these connection pins divides the surface of the film into a first region and a second region, with the coupling side of the connector lying on the planar side of the metal plate opposite the side carrying the multi-layer film; power components disposed on the first region of the multi-layer film; and mechanical cover means attached to the metal plate to form a flat housing, in which the mechanical means only covers the side of the metal plate carrying the multi-layer circuit board or film.
The metal plate provided according to the invention serves, on the one hand, as a carrier for the multi-layer circuit board or multi-layer film and the power components and thus function as a heat sink. On the other hand, the metal plate also serve as part of the housing. In this way, it is possible to automatically equip the multi-layer circuit board or the multi-layer film with the S
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Burgdorf Jochen
Loreck Heinz
Schirmer Klaus
Alfred Teves GmbH
Telefunken electronic GmbH
Tolin Gerald P.
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