Housing for encapsulating an electronic circuit

Details Housing for encapsulating an electronic circuit Housing for encapsulating an electronic circuit

1986-12-17

1988-07-05

Tolin, G. P.

Electricity: electrical systems and devices

Miscellaneous

361388, 361395, 357 74, 439 70, H05K 706

Patent

active

047559101

ABSTRACT:
A housing more particularly intended for encapsulating a wafer scale electronic circuit, realized in hybrid technology or integrated on semi-conducting substrate. In this housing:

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Miersch, "High-Speed Metal Carrier Packaging System Using Thin-film Interconnection Techniques," IBM Technical Disclosure Bulletin, vol. 23, No. 1, Jun. 1980, pp 374-377.
Martin, "Hermetic Hybrid Module," IBM Technical Disclosure Bulletin, vol. 21, No. 10, Mar. 1979, pp 4023-4024.

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