Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1998-10-01
2001-07-10
Gandhi, Jayprakash N. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S736000, C361S801000, C029S856000, C264S272110, C235S492000
Reexamination Certificate
active
06259606
ABSTRACT:
BACKGROUND OF THE INVENTION
The invention relates to an electronic card for electromagnetic data exchange, the electronic card having an electronic circuit, which is contained in a housing, as well as process for manufacturing such a card.
Electronic cards with an implemented electronic circuit are already known and are used, for example, as telephone cards, as credit cards with an integrated telephone card function, etc. In these cases, the electronic circuit is contained in an hermetically-encapsulated casing and is placed upon a supporting element of the electronic card. The disadvantage of this procedure is that it can be carried out only at rather high costs, since the encapsulating of the microchip is difficult to carry out, due to the temperature sensitivity of its electronic components.
Nowadays such electronic cards are used not only for the above-mentioned functions, but they are also used as so-called transponder cards, such as electronic cards for a radio-frequency identification system for tracing luggage, for example. Here the electronic circuit consists of an antenna element and an evaluation unit connected to the antenna element via thin wires. Due to its spatial extension, such an electronic circuit can no longer be encapsulated by a simple plastics injection moulding process—like a microchip for example—since the wires connecting the antenna element and the evaluating unit of the electronic circuit would be damaged due to the pressure resulting from the injection moulding process. Therefore, at present the electronic circuit has to be sealed via a laminating process, carried out at a temperature of 130° for 20 to 30 minutes. The disadvantage of using such a procedure is that the necessary working temperature for the electronic card circuit generally reaches the limits of technological feasibility, so that during the present production of such an electronic cards a high failure rate is expected.
It must be clarified that the above-mentioned cards are cards which are neither electronic cards such as are used with personal computers for example, nor electronic cards whose casing already constitutes the final casing for the electronic card.
SUMMARY OF THE INVENTION
It is the object of the invention to develop a housing for an electronic circuit of an electronic card, which is easy to produce and which yields a proper protection for the electronic circuit contained within.
This object is achieved according to the invention in that the housing is provided with a bottom element and a top element, in that the electronic circuit is contained between the inner surfaces of these two elements, that at least one of the bottom element and the top element is provided with at least one recess, into which the electronic circuit is inserted, that the shape of the recess corresponds to the outer shape of the electronic circuit, that the electronic circuit is at least partially covered by the top element, and that the housing is encased by a sheating made of plastics.
A housing for the electronic circuit of an electronic card is created in an advantageous manner by the procedures according to the invention and this housing can be produced via a simple plastics injection moulding process in a convenient way. The recesses according to the invention, provided at least within the bottom element of the housing, make it advantageously possible to incorporate even spatially extended electronic circuits, which are contained within the housing, safe and protected form outer temperatures, after the top element has been placed upon the bottom element and the two elements have been connected, if required. Subsequently, in order to produce the actual electronic card, the housing according to the invention can be placed, together with the electronic circuit protected from mechanical and/or thermal influences, into a plastics injection moulding machine and the injection moulding process can then be carried out.
An advantageous further development of the invention provides that at least one of the bottom element and the top element of the housing according to the invention are provided with at least two spatially separate recesses for receiving two separate components of the electronic circuit, whereby these two recesses are connected via at least one recess for receiving wires connecting the two above-mentioned components. Such a design has the advantage that in this way even electronic circuits consisting of several spatially separate components can be contained in a convenient manner within the housing according to the invention, protected from mechanical and/or thermal influences.
Another advantageous development of the invention provides that one of the two recesses provided serves to receive an antenna element and the other recess serves to receive an evaluation unit of the electronic circuit. This design is particularly suitable for an electronic card that is to be used as a radio-frequency identification system.
In an advantageous further development of the invention, the housing is made of an elastic material. Thus a flexible construction of the electronic card is obtained in a convenient manner.
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patent: 5461256 (1995-10-01), Yamada et al.
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patent: 5894006 (1999-04-01), Herbst
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patent: 2673065 (1992-08-01), None
Brezina & Ehrlich
Gandhi Jayprakash N.
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