Housing for electronic apparatus and method of damping unwanted

Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition

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174 35R, H05K 900

Patent

active

058410678

ABSTRACT:
A housing for electronic apparatus which is effectively protected against electromagnetic wave leakage, the housing being equipped or lined, in an area of the conductive layer-carrying inside surface of the housing, the area adjoining, or is in the vicinity of, an opening of the housing, with a sheet molded, to a thickness of 70 to 300 .mu.m, from a magnetic material-containing resin composition comprising 7 to 60% by weight of a binder resin (a) and 40 to 93% by weight of a finely divided magnetic material (b) having a magnetic loss term, and a method of damping unwanted radiation of electromagnetic waves.

REFERENCES:
patent: 5539148 (1996-07-01), Konishi et al.

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