Housing for electrical and electronic components

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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228208, 428429, H05K 506

Patent

active

043384862

ABSTRACT:
A housing package for the encapsulation of electrical components. The package comprises a base plate and a cap which encapsulate the electrical components. Electrical leads are lead through the base plate. The package is provided with a coating which increases the solderability of the electrical leads and increases the corrosion resistance of the housing.

REFERENCES:
patent: 2814572 (1957-11-01), Frye
patent: 3265942 (1966-08-01), Osborne
patent: 3586926 (1971-06-01), Nakamura et al.
patent: 3675310 (1972-07-01), Schwaneke et al.
patent: 4177322 (1979-12-01), Homan et al.

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