Housing for diverse cooling configuration printed circuit cards

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

361701, 16510433, 165 803, 165 801, H05K 336

Patent

active

060265655

ABSTRACT:
A printed circuit card housing provides separate cooling fluid travel paths for convectively cooling on-board heat exchangers of non mil. spec. component-retaining printed circuit cards, and for thermal conductive cooling of conventional (VME) circuit cards, while keeping both types of circuit cards sealed from contaminants that may be present in the cooling fluid. The housing includes a chassis having a card slot cavity, into which both types of printed circuit cards are retained. A cooling fluid supply/exhaust plenum provides a first cooling fluid travel path that is ported to only convectively cooled circuit cards. In order to cool the remaining circuit cards, the cooling fluid supply/exhaust plenum ports cooling fluid entering the plenum along a second cooling fluid travel path through heat exchangers installed along sidewalls of the chassis.

REFERENCES:
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patent: 5414592 (1995-05-01), Stout et al.
patent: 5440450 (1995-08-01), Lau et al.
patent: 5457342 (1995-10-01), Herbst, II
patent: 5467251 (1995-11-01), Katchmar
patent: 5473508 (1995-12-01), Porter et al.
patent: 5473511 (1995-12-01), Reddy et al.

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