Housing for a power module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S730000, C361S752000, C361S715000, C174S520000, C257S678000

Reexamination Certificate

active

07821791

ABSTRACT:
A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The power module has at least one module board element and a housing formed with shafts for the pressure contact elements. The shafts open out from the housing base facing printed circuit board at opening orifices. The base is formed with orifice sealing ribs around the opening orifices. Moreover, the base of the housing may have a peripheral edge sealing rib along its outer edge. Furthermore, a sealing area element can be provided between the printed circuit board and the base of the housing.

REFERENCES:
patent: 6417747 (2002-07-01), Dearden et al.
patent: 6459582 (2002-10-01), Ali et al.
patent: 6507108 (2003-01-01), Lindemann et al.
patent: 6867972 (2005-03-01), Franke
patent: 6979204 (2005-12-01), Gobl et al.
patent: 7187074 (2007-03-01), Uchiyama et al.
patent: 7301773 (2007-11-01), Brewer et al.
patent: 7495324 (2009-02-01), Popp et al.
patent: 7557442 (2009-07-01), Licht
patent: 7589418 (2009-09-01), Lederer et al.
patent: 7592698 (2009-09-01), Lederer et al.
patent: 7683472 (2010-03-01), Popp
patent: 2009/0021922 (2009-01-01), Popp et al.
patent: 196 30 173 (1998-01-01), None
patent: 10 2005 024 900 (2006-01-01), None
patent: 10 2006 052 620 (2008-05-01), None
patent: 1 592 063 (2005-11-01), None
patent: 2005-217075 (2005-08-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Housing for a power module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Housing for a power module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Housing for a power module will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4239990

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.