Housing for a photoactive semiconductor chip and a method...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S431000, C257S432000, C257S433000, C257SE25032, C438S048000, C438S064000

Reexamination Certificate

active

07115962

ABSTRACT:
In a process for producing a ceramic housing (1), first of all a ceramic base body (4) comprising a ceramic base (2) and side parts (3) is produced. Then, a metal frame (7) is placed onto the ceramic base body (4) and a window (11) is soldered onto a side opening (6). After a photoactive semiconductor chip has been introduced into the ceramic base body (4), the ceramic housing (1) is closed off using a metal cover (12).

REFERENCES:
patent: 5132532 (1992-07-01), Watanabe
patent: 5841178 (1998-11-01), Butrie et al.
patent: 6420205 (2002-07-01), Sawai
patent: 6531341 (2003-03-01), Peterson et al.
patent: 61-13677 (1986-01-01), None
patent: 361013677 (1986-01-01), None
patent: 06151629 (1995-05-01), None
patent: 08316503 (1996-11-01), None
patent: 10275873 (1998-10-01), None
patent: 410275873 (1998-10-01), None
patent: 11176017 (1999-07-01), None
patent: 2000223605 (2000-08-01), None
patent: WO 8702833 (1987-05-01), None

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