Housing for a compression bonded encapsulation of a semiconducto

Details Housing for a compression bonded encapsulation of a semiconducto Housing for a compression bonded encapsulation of a semiconducto

1974-06-21

1976-11-16

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 74, 357 79, 174 52R, 174 52PE, H01L 2328

Patent

active

039927172

ABSTRACT:
An assembly comprising a metal-semiconductor-metal element, an insulating sleeve member disposed about the metal-semiconductor-metal element and a metal pole piece contact. The three elements together form a disc-shaped power semiconductor device assembly for operation in a compression bonded application.

REFERENCES:
patent: 3450962 (1969-06-01), Ferree et al.
patent: 3499095 (1970-03-01), Haus
patent: 3515955 (1970-06-01), Butenschon
patent: 3548267 (1970-12-01), Siddell
patent: 3559001 (1971-01-01), Cooper et al.
patent: 3597524 (1971-08-01), Schreiner
patent: 3686542 (1972-08-01), Rindner et al.
patent: 3721867 (1973-03-01), Schierz
patent: 3837000 (1974-09-01), Platzoeder et al.

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