Housing assembly utilizing a heat shrinkable composite laminate

Details Housing assembly utilizing a heat shrinkable composite laminate Housing assembly utilizing a heat shrinkable composite laminate

1998-02-02

2000-10-17

Abrams, Neil

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

H05K 900

Patent

active

061341215

ABSTRACT:
A housing assembly includes a printed circuit board (PCB) (104), at least one electrical component (106) mounted on at least one side of the PCB (104) and electrically coupled thereto, a frame (102, 108) surrounding selected portions of the PCB (104), and a heat shrinkable composite laminate (110) having an inner conductive surface (115) and a non-conductive outer surface (140). The laminate (110) forms an enclosure supported by the frame (102, 108) about the PCB (104) and the at least one electrical component (106). The laminate outer surface (140) can be conductively coated and a contact (109) fixed to the PCB (104) can be used for electrically coupling to the inner conductive surface (115). The laminate (110) can include orifices (111,130) for a connector (107) and an antenna (113). In other embodiments (FIGS. 9, 10) a heat shrinkable composite laminate (120) can be electrically joined to a metal shell of a component (106) which is grounded through a pin (118) or the laminate outer surface (144) can be grounded to a metal cover.

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Shrink Mate Conductive Heat Shrink Connectors Data Sheet, Methode Devolpment Co., a subsidiary of Methode Electronics, Inc., Chicago, IL.

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