Housing assembly for electronic components

Details Housing assembly for electronic components Housing assembly for electronic components

1989-05-01

1991-10-22

Tolin, Gerald P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 26427211, 439403, H05K 500

Patent

active

050597469

ABSTRACT:
Housing assembly for components, such as Hall effect sensors, comprises an inner housing of premolded relatively firm plastic material and an outer housing which is overmolded on the inner housing. The components are contained in cavities in the inner housing. Passageways extend through the inner housing to the cavities and the soft overmolded material flows through these passageways and forms a surrounding cushion within the cavities for the components. Also disclosed is a system for mounting proximity sensors on an automotive door lock or the like in a manner which detects the fully closed and the partially closed conditions of the door.

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patent: 4822299 (1989-04-01), Rider, Jr.

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