Hotspot coldplate spray cooling system

Refrigeration – Material cooling means including gas-liquid contactor

Reexamination Certificate

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Details

C062S259200

Reexamination Certificate

active

10786243

ABSTRACT:
The present invention is a coldplate hotspot spray cooling system that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon a spray pin protruding from a base wherein the liquid creates a very high heat absorbing evaporative thin film. The spray pin is located over an area of the chip that produces a large heat flux, typically referred to as a hotspot. The small size and isolation of the spray pin provides the ability to generate very large heat fluxes. Multiple spray pins are possible.

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