Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Patent
1994-10-13
1996-08-20
McCamish, Marion E.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
524505, C08L 7708
Patent
active
055480276
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a hotmelt adhesive, to its production and use and to moldings produced with the hotmelt adhesive.
2. Discussion of Related Art
Hotmelt adhesives are adhesives solid at room temperature which are temporarily melted to perform their adhesive function. They are based essentially on polyamides, polyolefins or polyesters and mixtures thereof. By incorporation of additives, they can be further optimized for the particular applications envisaged.
Thus, a hotmelt adhesive for bonding non-pretreated polyethylene and copper in accordance with DE-OS 35 04 804 consists essentially of the following compatible components: modifying additives, unsaturated dicarboxylic acid and optionally (meth)acrylates and/or vinyl esters and tackifiers. compositions such as these without any need for the otherwise usual pretreatment and although the low-temperature properties are still remarkably good at -20.degree. C. and lower, the known hotmelt adhesives have the following disadvantage: their softening points are too high, for example for the processing of shrunk articles. Softening points of <130.degree. C. are generally required for this application.
EP-A1-0 040 926 also describes a hotmelt adhesive for bonding untreated polyethylene. This known hotmelt adhesive contains carboxyl groups and optionally acrylate, butyl acrylate, methoxyethyl acrylate and ethoxyethyl acrylate. and softening point of the hotmelt adhesive so that it may well be that the products described are unsuitable for certain applications, for example for the processing of shrunk articles. For adhesion to non-pretreated polyethylene, it is important to bear in mind that, in many cases, not only high strengths, but also a balanced ratio of adhesion to substrate surface/inner cohesion is required so that, besides high strength values, a cohesive fracture pattern is also obtained in peel tests. None of this is mentioned in EP-A1-0 040 926.
U.S. Pat. No. 4,552,819 describes a hotmelt adhesive for coating shrinkable moldings of polyethylene for the electrical industry, more particularly the cable industry, which contains the following components: amine value of 0.5 to 15, hydrolyzed according to the statement of invention, but not in the comparative tests, styrene/isoprene/styrene and optionally polyethylene cannot be obtained. In addition, the softening points are too high.
Finally, EP-A1-0 079 178 describes a hotmelt adhesive for bonding non-pretreated polyethylene which has the following composition: and/or an alkyl ester thereof and vinyl acetate where the copolymer does not contain any alkyl ester units, example. Compositions such as these have the disadvantage that they lack sufficient resistance to chemicals.
DE-OS 23 47 799 describes heat-resilient moldings of crosslinked polyethylene with at least one layer of a hotmelt adhesive of the following composition: non-pretreated polyethylene.
DESCRIPTION OF THE INVENTION
This invention relates to a hotmelt adhesive comprising: fatty acid, group consisting of ethylene/vinyl acetate, ethylene/acrylate, said acrylate being derived from an alcohol containing 1 to 18 carbon atoms, and ethylene/methacrylate, said methacrylate being derived from an alcohol containing 1 to 18 carbon atoms, members selected from the group consisting of ethylene, isoprene and butylene, consisting of polycyclopentadiene, polyterpene, liquid hydrocarbon resin and the group consisting of ethylene, propylene, butylene and maleic anhydride.
The problem addressed by the invention was to remedy the situation described above.
The invention is defined in the claims and lies essentially in the choice of the components listed.
DETAILED DESCRIPTION OF THE INVENTION
The hotmelt adhesive according to the invention contains at least 50% by weight of at least one polyamide based on dimerized fatty acid as its key component. "Dimerized fatty acids" are obtained by the coupling of unsaturated long-chain monobasic fatty acids, for example linolenic acid, oleic acid. It is
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R. F. Paschke, L. E. Peterson and D. H. Wheeler, Journal of the American Oil Chemists' Society, 41, 723 (1964).
Heucher Reimar
Kopannia Siegfried
Rossini Angela
Schueller Kurt
Wichelhaus Juergen
Henkel Kommanditgesellschaft auf Aktien
Jaeschke Wayne C.
McCamish Marion E.
Ortiz Daniel S.
Wood John Daniel
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