Hot stamping method

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156230, 156241, 156249, 156344, B32B 3100, B44C 116

Patent

active

046455558

ABSTRACT:
A hot stamping method enables the formation of very sharp edges and profiles of characters
umerals, patterns and the like upon a surface of a base plate. This method comprises a masking step making certain characters, numerals and patterns formed by a masking layer upon a surface of a base plate; a step of placing a foil sheet having an adhesive layer upon a surface of the masking layer and a surface of the base plate, and transferring a foil of the foil sheet to the surface of the base plate by means of heat and pressure; and a step of leaving the transferred foil upon the surface of the base plate and releasing the masking layer and the foil transferred to the surface thereof from the base plate.

REFERENCES:
patent: 3554835 (1971-01-01), Morgan
patent: 3658616 (1972-04-01), Dreyer
patent: 3936570 (1976-02-01), Iwata
patent: 4484970 (1984-11-01), Burzlaff et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Hot stamping method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot stamping method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot stamping method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-107622

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.